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An In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
- Source :
- 2023 International Conference on Electronics Packaging (ICEP).
- Publication Year :
- 2023
- Publisher :
- IEEE, 2023.
Details
- Database :
- OpenAIRE
- Journal :
- 2023 International Conference on Electronics Packaging (ICEP)
- Accession number :
- edsair.doi...........ba46a4aafcea8bf6fbaa62097d260be7