Back to Search
Start Over
Mechanical properties of thin monocrystalline Si wafer cut by multi-wire saw
- Source :
- The Proceedings of Conference of Hokuriku-Shinetsu Branch. :B033
- Publication Year :
- 2020
- Publisher :
- Japan Society of Mechanical Engineers, 2020.
Details
- ISSN :
- 24242772
- Database :
- OpenAIRE
- Journal :
- The Proceedings of Conference of Hokuriku-Shinetsu Branch
- Accession number :
- edsair.doi...........bd45d770173fb475390d5b24600067d7
- Full Text :
- https://doi.org/10.1299/jsmehs.2020.57.b033