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Effect of radial grooves pads on copper chemical mechanical polishing

Authors :
Chulwoo Bae
Shinil Oh
Juhwan Kim
Donggeon Kwak
Seungjun Oh
Taesung Kim
Source :
Materials Science in Semiconductor Processing. 151:106968
Publication Year :
2022
Publisher :
Elsevier BV, 2022.

Subjects

Subjects :
Mechanics of Materials
Mechanical Engineering
General Materials Science
Condensed Matter Physics

Details

ISSN :
13698001
Volume :
151
Database :
OpenAIRE
Journal :
Materials Science in Semiconductor Processing
Accession number :
edsair.doi...........bdc6027c57b4dc029d501534c26ad539
Full Text :
https://doi.org/10.1016/j.mssp.2022.106968
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