Integration of Cu/SiOC in dual damascene interconnect for 0.1 μm technology using a new SiC material as dielectric barrier

This work was focused on the integration of Cu/SiOC dual damascene interconnect modules for 0.1 /spl mu/m node technology. A complete study was performed on the impact of the dielectric barrier material on the integration approach. It was shown that a nitrogen free SiC barrier layer was necessary to integrate SiOC in the currently used via first dual damascene architecture. The performance of this new material was evaluated in terms of etching selectivity, resist poisoning and ARC lithography behaviour, electrical and reliability results. On all these aspects, SiC was found better than SiCN.