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Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- Source :
- 2017 IEEE International Interconnect Technology Conference (IITC).
- Publication Year :
- 2017
- Publisher :
- IEEE, 2017.
-
Abstract
- Co/Cu composite interconnect systems were studied. Since wide Cu lines require a diffusion barrier which is simultaneously applied also to fine Co lines to reduce Co volume fraction, through-Cobalt Self-Formed-Barrier (tCoSFB) was employed to thin down TaN barrier to
- Subjects :
- 010302 applied physics
Interconnection
Materials science
Diffusion barrier
business.industry
Annealing (metallurgy)
Composite number
chemistry.chemical_element
02 engineering and technology
021001 nanoscience & nanotechnology
01 natural sciences
Copper
chemistry
0103 physical sciences
Volume fraction
Electronic engineering
Optoelectronics
0210 nano-technology
business
Electrical conductor
Cobalt
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2017 IEEE International Interconnect Technology Conference (IITC)
- Accession number :
- edsair.doi...........bee45ddd3e678c8a6dca939c6a6b11e4
- Full Text :
- https://doi.org/10.1109/iitc-amc.2017.7968961