Die chipping FDC development at wafer saw process

The die chipping which cause function failure always a key issue for BiCSX wafer saw. Traditionally, detecting the defects by die seal ring inspection after it has occurred has been large-scale adoption. However, this method has large limitation due to two factors. First is nuisance defect which may cause by manual classification; second is additional investment from detection machine. Fault Detection and Classification (FDC) as one part of Advanced Process Control (APC) has been widely studied in semiconductor manufacturing. FDC can detect the defects like die chipping by record and analysis equipment data during wafer saw. It can not only detect the defects but also help engineer to develop robust process. In this paper, the mechanism of die chipping and the interaction of equipment data with defects were studied. Successfully create a totally new FDC rule to detect the die chipping.