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Encapsulant for fatigue life enhancement of controlled collapse chip connection (C4)
- Source :
- Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
- Publication Year :
- 2002
- Publisher :
- IEEE, 2002.
Details
- Database :
- OpenAIRE
- Journal :
- Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)
- Accession number :
- edsair.doi...........c20ddd1ef41c0ca0f5158708100fd55a