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Encapsulant for fatigue life enhancement of controlled collapse chip connection (C4)

Authors :
D.W. Wang
K.I. Papathomas
Source :
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
Publication Year :
2002
Publisher :
IEEE, 2002.

Details

Database :
OpenAIRE
Journal :
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)
Accession number :
edsair.doi...........c20ddd1ef41c0ca0f5158708100fd55a