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Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integrations
- Source :
- 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
- Publication Year :
- 2019
- Publisher :
- IEEE, 2019.
Details
- Database :
- OpenAIRE
- Journal :
- 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
- Accession number :
- edsair.doi...........c5bc22b3c79490748fda0c034e4f2969