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Highly transparent flexible polydimethylsiloxane films - a promising candidate for optoelectronic devices
- Source :
- Polymer International. 65:535-543
- Publication Year :
- 2016
- Publisher :
- Wiley, 2016.
-
Abstract
- In the present work, a siloxane based flexible substrate for optoelectronic applications with improved flexibility and high temperature withstanding capacity has been fabricated and the details are reported. The structural and optical properties of the substrate were characterized and the optical transparency is found to be about 90% − 95% in the visible region. The substrate withstands temperatures up to 300 °C without significant degradation and has a low thermal coefficient of expansion. Fourier transform infrared spectral data show the materials in the prepared substrate and SEM studies show the surface and cross-sectional characteristics of the substrate. It has good mechanical strength, can withstand a high breaking load of 7 N, has a average tensile strength of 48.86 MPa and high average tensile modulus of 127.32 and also possesses excellent surface smoothness and resistance to both chemical and moisture with better rigidity; it will be a long lasting alternative for flexible plastic substrates. The optical characteristics such as refractive index (n) and extinction coefficient (k) are also reported. © 2016 Society of Chemical Industry
- Subjects :
- Materials science
Polymers and Plastics
Young's modulus
02 engineering and technology
010402 general chemistry
01 natural sciences
symbols.namesake
chemistry.chemical_compound
Ultimate tensile strength
Materials Chemistry
Transmittance
Composite material
chemistry.chemical_classification
Polydimethylsiloxane
business.industry
Organic Chemistry
Polymer
Molar absorptivity
021001 nanoscience & nanotechnology
0104 chemical sciences
chemistry
Siloxane
symbols
Optoelectronics
0210 nano-technology
business
Refractive index
Subjects
Details
- ISSN :
- 09598103
- Volume :
- 65
- Database :
- OpenAIRE
- Journal :
- Polymer International
- Accession number :
- edsair.doi...........c851959e6700c9bc85f861b0cb9b003b