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A Novel Lead-Free Low-Temperature Solder with Excellent Drop-Shock Re-sistance

Authors :
Hongwen Zhang
Samuel Lytwynec
Ning-Cheng Lee
Sze Pei Lim
Source :
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Publication Year :
2021
Publisher :
IEEE, 2021.

Details

Database :
OpenAIRE
Journal :
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Accession number :
edsair.doi...........cb2dcd66f492aaf6979364fbc7d00c4a

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