Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon

Authors :: Ming Li
Xiaoguang Guo
Siyang Dai
Song Yuan
Jianli Ma
Fumin Liu
Lemin Zhang
Dongming Guo
Ping Zhou
Source :: Materials Science in Semiconductor Processing. 151:107019
Publication Year :: 2022
Publisher :: Elsevier BV, 2022.

Subjects :: Mechanics of Materials
Mechanical Engineering
General Materials Science
Condensed Matter Physics

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