Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Subjects

Subjects :

Materials science
Fabrication
Mechanics of Materials
Property (programming)
business.industry
Mechanical Engineering
Interposer
Optoelectronics
Radio frequency
Electrical and Electronic Engineering
business
Electronic, Optical and Magnetic Materials

Details

ISSN :

13616439 and 09601317

Volume :

29

Database :

OpenAIRE

Journal :

Journal of Micromechanics and Microengineering

Accession number :

edsair.doi...........ccd5fe89d3d311bff3cca3b36024d867

Full Text :

https://doi.org/10.1088/1361-6439/ab1d30