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Reducing the nano-scale defect formation of atomic-layer-deposited SrTiO3 films by adjusting the cooling rate of the crystallization annealing of the seed layer
- Source :
- Thin Solid Films. 589:723-729
- Publication Year :
- 2015
- Publisher :
- Elsevier BV, 2015.
-
Abstract
- SrTiO3 (STO) thin films, grown by atomic layer deposition (ALD), were studied for capacitors in dynamic random access memory. The STO ALD process consisted of two steps: the growth of seed layer followed by a rapid thermal annealing (RTA) process at 650 °C to crystallize it, and the deposition of the main layer on top of the seed layer at 370 °C to induce the in-situ crystallization. During single cooling process after the RTA of the seed layer, voids and nano-cracks were formed due to the thermal expansion mismatch between STO film and Si substrate. This problem was well mitigated by adopting the stepwise cooling process, wherein the holding time of 30 s at 500, 350, and 200 °C suppressed the defect formation in the seed layer. Therefore, the main layer grown on that seed layer showed an improved microstructure with a high bulk dielectric constant of 135. However, the increase in total annealing time degraded the interface quality between the STO and the bottom electrode, which finally worsened the insulating property. As a result, the minimum equivalent oxide thicknesses with low leakage current densities (< 10− 7 A/cm2 at 0.8 V) for the single and stepwise cooling processes were 0.39 nm and 0.46 nm, respectively.
- Subjects :
- Materials science
Annealing (metallurgy)
Metals and Alloys
Surfaces and Interfaces
Dielectric
Microstructure
Thermal expansion
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
law.invention
chemistry.chemical_compound
Crystallography
Atomic layer deposition
chemistry
law
Materials Chemistry
Strontium titanate
Composite material
Crystallization
Thin film
Subjects
Details
- ISSN :
- 00406090
- Volume :
- 589
- Database :
- OpenAIRE
- Journal :
- Thin Solid Films
- Accession number :
- edsair.doi...........cd6f94beef8567fc510296527e91bd0d