Extracting interdiffusion parameters from Ni/Cu thin films by means of profile reconstruction with the MRI model

Thin film diffusion studies often involve a surface-sensitive analysis technique combined with ion erosion to produce a depth profile of a sample. Such studies compare the depth profile of a reference sample to the depth profiles of samples that were annealed at different temperatures and times. The extent to which atoms of one layer diffuse into an adjacent layer, for a particular temperature and time, yields information on the diffusion process involved and allows quantification of the diffusion coefficient. The drawback to using an erosion-type system is the effect of the incident ions on the surface being probed. The Mixing-Roughness-Information model attempts to compensate for this effect and is often employed as a means of quantification of measured depth profiles by means of profile reconstruction. Used in conjunction with Auger electron spectroscopy, the Mixing-Roughness-Information (MRI) model is a useful tool to reconstruct the ion erosion depth profiles as well as extracting interdiffusion parameters from these depth profiles. This study focuses on the extraction of the diffusion coefficient of Ni in Cu from Ni/Cu depth profiles obtained from ion erosion Auger electron spectroscopy. The resultant depth profiles were reconstructed with the MRI model. The diffusion coefficient for Ni diffusing in Cu was obtained from the MRI fit and it compared well to values available in literature.