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A unique approach for bare die testing which utilizes Au-stud-bumping technology and TAB technology
A unique approach for bare die testing which utilizes Au-stud-bumping technology and TAB technology
- Source :
- 1997 Proceedings 47th Electronic Components and Technology Conference.
- Publication Year :
- 2002
- Publisher :
- IEEE, 2002.
-
Abstract
- A unique approach for bare die testing is introduced which utilizes the combination of the Au-stud-bumping technology on a die pad and the TAB technology commonly used for packaging. The proposed technique here bumps Au stud bumps on Al bonding pads on a die using the common wire-bonding technology and makes contact between the Au stud bumps and the Au-plated terminals formed on the TAB film. The Au-to-Au touch can attain the small and stable contact resistance between them. The prototype bare die carrier of this approach has been completed and the result of the first-stage evaluation is described.
Details
- Database :
- OpenAIRE
- Journal :
- 1997 Proceedings 47th Electronic Components and Technology Conference
- Accession number :
- edsair.doi...........cfe0df24eeb66adbee4adadb4784a2ac
- Full Text :
- https://doi.org/10.1109/ectc.1997.606303