Bottom Tier High Voltage Vevice Thermal Stability in 3D Sequential Integration for More than Moore Applications

Authors :: Jean-Pierre Colinge
Gerard Ghibaudo
C. Fenouillet
X. Garros
N. Rambal
C. Cavalcante
Joris Lacord
T. Karatsori
M. Casse
Francois Andrieu
M. Vinet
Perrine Batude
O. Rozeau
D. Lattard
Source :: Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials.
Publication Year :: 2019
Publisher :: The Japan Society of Applied Physics, 2019.

Subjects :: Materials science
Thermal stability
High voltage
Engineering physics

Database :: OpenAIRE
Journal :: Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials
Accession number :: edsair.doi...........d200e765a40881962831f20754190b13

Tools