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Determination of the AlN nucleation layer thickness formed on the Al-=SUB=-2-=/SUB=-O-=SUB=-3-=/SUB=-(0001) surface during nitridation process by XPS and IR spectroscopy

Authors :
null Zhuravlev K. S.
null Yakovlev V. A.
null Novikova N. N.
null Kozhukhov A. S.
null Mansurov V. G.
null Malin T. V.
null Milakhin D. S.
Source :
Semiconductors. 56:518
Publication Year :
2022
Publisher :
Ioffe Institute Russian Academy of Sciences, 2022.

Abstract

The effect of different degrees of the sapphire surface nitridation process completion on the AlN buffer layer morphology has been studied. It was found that ~85% completion of the AlN crystalline phase formation promotes the growth of a two dimensional AlN buffer layer with a smooth surface morphology, regardless of the substrate temperature and ammonia flux. In contrast, during the AlN nucleation layer formation as a result of weak or excessive sapphire nitridation, a polycrystalline or three-dimensional AlN structures with a high density of inversion domains, respectively, were formed. Using independent methods of X-ray photoelectron spectroscopy and infrared spectroscopy of surface polaritons, the thickness of the AlN nucleation layer was determined at ~85% degree of the nitridation process completion, which amounted to ~1 monolayer. Keywords: ammonia molecular beam epitaxy, AlN, sapphire, reflection high-energy electron diffraction, nitridation, inversion domains, X-ray photoelectron spectroscopy, surface polaritons.

Details

ISSN :
17267315
Volume :
56
Database :
OpenAIRE
Journal :
Semiconductors
Accession number :
edsair.doi...........d3e9aba2ec52aa06879689c0614b8f20
Full Text :
https://doi.org/10.21883/sc.2022.08.54455.23