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Preparation and Characterization of Bi0.4Sb1.6Te3 Bulk Thermoelectric Materials

Authors :
Tetsuhiko Onda
Takahiro Hayashi
Zhong-Chun Chen
Kenji Matsuoka
Yuki Nagami
Takahiro Akao
Source :
Journal of Electronic Materials. 43:2262-2268
Publication Year :
2014
Publisher :
Springer Science and Business Media LLC, 2014.

Abstract

This work focused on the preparation of p-type Bi0.4Sb1.6Te3 bulk materials by combining mechanical alloying (MA) and hot extrusion, with emphasis on grain refinement and preferred grain orientation. Pure Bi, Sb, and Te powders were mechanically alloyed then hot extruded in the temperature range 360–450°C. Bi0.4Sb1.6Te3 bulk materials were successfully prepared by MA and hot extrusion. All the samples had sound appearance, with single phases and high densities. The hot-extruded samples had small grain sizes, and the lower the extrusion temperature, the smaller the grain sizes. The results indicated that the extrudates had preferred orientation. The basal plane was predominantly oriented parallel to the direction of extrusion. Similar Seebeck coefficients were obtained when extrusion temperature was in the range 380–420°C. Electrical resistivity decreased with increasing extrusion temperature. Thermal conductivity was relatively low, even if the extrusion temperature was 450°C. As a result, a ZT value of 1.2 was obtained at room temperature for the sample extruded at 400°C. Therefore, combination of MA and hot extrusion results in significant improvement of both the thermoelectric and mechanical performance of Bi0.4Sb1.6Te3 bulk materials.

Details

ISSN :
1543186X and 03615235
Volume :
43
Database :
OpenAIRE
Journal :
Journal of Electronic Materials
Accession number :
edsair.doi...........d53577bb87ce6a8981f884b9440c3b05
Full Text :
https://doi.org/10.1007/s11664-014-3038-0