Digital Lithography for Advanced Packaging and Heterogenous Integration

MLA

B. Dielacher, et al. “Digital Lithography for Advanced Packaging and Heterogenous Integration.” 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), Dec. 2022. EBSCOhost, https://doi.org/10.1109/eptc56328.2022.10013141.

APA

B. Dielacher, S. Schmolzer, T. Matthias, B. Povazay, F. Bogelsack, R. Holly, T. Zenger, T. Uhrmann, & B. Thallner. (2022). Digital Lithography for Advanced Packaging and Heterogenous Integration. 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc56328.2022.10013141

Chicago

B. Dielacher, S. Schmolzer, T. Matthias, B. Povazay, F. Bogelsack, R. Holly, T. Zenger, T. Uhrmann, and B. Thallner. 2022. “Digital Lithography for Advanced Packaging and Heterogenous Integration.” 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), December. doi:10.1109/eptc56328.2022.10013141.