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A Single-Layer Step-Bridge for Out-Of-Plane Thermal Actuator

Authors :
Weileun Fang
Chih-Fan Hu
Po-I Yeh
Wen-Chih Chen
Source :
TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.
Publication Year :
2007
Publisher :
IEEE, 2007.

Abstract

This study presents the design and fabrication of a single-layer out-of-plane thermal actuator. The step-bridge structure design enables the actuator bent and then buckled in the out-of-plane direction by Joule-heating. In summary, the step-bridge actuator design has five merits: (l)The linear load-deflect ion relation is achieved, (2)The bi-stable buckling behavior is prevented, (3)The unwanted vibration modes can be suppressed, (4)The delamination problem is prevented, and (5)The bridge structure is stiffer and more stable. The actuator and its application on a lens positioning stage have been implemented using p++ Si layer by bulk micromachining.

Details

Database :
OpenAIRE
Journal :
TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference
Accession number :
edsair.doi...........d953682808669ca17ea34718ed43c56f
Full Text :
https://doi.org/10.1109/sensor.2007.4300598