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Grain boundary sliding behaviour of copper and alpha brass at intermediate temperatures

Authors :
S. V. Raj
Source :
Journal of Materials Science. 26:1000-1008
Publication Year :
1991
Publisher :
Springer Science and Business Media LLC, 1991.

Abstract

The role of grain boundary sliding in copper and Cu-30% Zn in the temperature range 0.50 to 0.72T m, whereT m is the absolute melting point of the material, is examined. First, sliding data obtained on these materials are presented. These results indicate that the stress exponent for sliding,n gbs, is similar to that for lattice deformation, while the activation energy for sliding,Q gbs, varies between about 0·5Q c and 1.6Q c, whereQ c is the activation energy for creep. Next, a comparison of the published values ofQ gbs for bicrystals and polycrystals suggests that grain boundary sliding in polycrystalline materials requires the accommodation of the sliding process, whereas in bicrystals, the absence of triple points and other grain boundaries results in intrinsic sliding. Finally, several models proposed for grain boundary sliding are discussed, and it is shown that they do not account for the observed results on copper and alpha brass. A phenomenological model is proposed, where it is assumed that grain boundary sliding results from the glide of dislocations on secondary slip planes.

Details

ISSN :
15734803 and 00222461
Volume :
26
Database :
OpenAIRE
Journal :
Journal of Materials Science
Accession number :
edsair.doi...........da1dc1b27e6b83af1cb19e8a13b801b8
Full Text :
https://doi.org/10.1007/bf00576778