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Grain boundary sliding behaviour of copper and alpha brass at intermediate temperatures
- Source :
- Journal of Materials Science. 26:1000-1008
- Publication Year :
- 1991
- Publisher :
- Springer Science and Business Media LLC, 1991.
-
Abstract
- The role of grain boundary sliding in copper and Cu-30% Zn in the temperature range 0.50 to 0.72T m, whereT m is the absolute melting point of the material, is examined. First, sliding data obtained on these materials are presented. These results indicate that the stress exponent for sliding,n gbs, is similar to that for lattice deformation, while the activation energy for sliding,Q gbs, varies between about 0·5Q c and 1.6Q c, whereQ c is the activation energy for creep. Next, a comparison of the published values ofQ gbs for bicrystals and polycrystals suggests that grain boundary sliding in polycrystalline materials requires the accommodation of the sliding process, whereas in bicrystals, the absence of triple points and other grain boundaries results in intrinsic sliding. Finally, several models proposed for grain boundary sliding are discussed, and it is shown that they do not account for the observed results on copper and alpha brass. A phenomenological model is proposed, where it is assumed that grain boundary sliding results from the glide of dislocations on secondary slip planes.
- Subjects :
- Materials science
Condensed matter physics
Mechanical Engineering
Metallurgy
Brass
Stress (mechanics)
Creep
Mechanics of Materials
visual_art
Phenomenological model
visual_art.visual_art_medium
General Materials Science
Grain boundary
Crystallite
Grain boundary strengthening
Grain Boundary Sliding
Subjects
Details
- ISSN :
- 15734803 and 00222461
- Volume :
- 26
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Science
- Accession number :
- edsair.doi...........da1dc1b27e6b83af1cb19e8a13b801b8
- Full Text :
- https://doi.org/10.1007/bf00576778