Back to Search
Start Over
Superhydrophobic Cu2S@Cu2O film on copper surface fabricated by a facile chemical bath deposition method and its application in oil-water separation
- Source :
- Applied Surface Science. 396:566-573
- Publication Year :
- 2017
- Publisher :
- Elsevier BV, 2017.
-
Abstract
- Cu 2 S and Cu 2 O composite (Cu 2 S@Cu 2 O) film with micro/nano binary structure was created on copper surface using the mixing solution of sodium thiosulphate and copper sulfate by a facile chemical bath deposition method. After modification with low-cost polydimethylsioxane (PDMS), the superhydrophobic Cu 2 S@Cu 2 O film was obtained. The as-prepared film shows outstanding water repellency with a water contact angle larger than 150° and long-term storage stability. The geometric morphology and chemical composition of the film were characterized by scanning electron microscope (SEM), energy dispersive spectrometer (EDS) and attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR), respectively. Moreover, the same method was used to fabricate superhydrophobic/superoleophilic copper mesh, and it could realize separation of various oily sewages with separation efficiency above 94%. This strategy has potential to fabricate the practical superhydrophobic Cu 2 S@Cu 2 O film on copper surface on a large scale due to its simplicity and low cost.
- Subjects :
- Materials science
Scanning electron microscope
Composite number
Analytical chemistry
General Physics and Astronomy
chemistry.chemical_element
02 engineering and technology
Surfaces and Interfaces
General Chemistry
010402 general chemistry
021001 nanoscience & nanotechnology
Condensed Matter Physics
01 natural sciences
Copper
0104 chemical sciences
Surfaces, Coatings and Films
Contact angle
chemistry
Attenuated total reflection
Nano
Fourier transform infrared spectroscopy
0210 nano-technology
Chemical bath deposition
Subjects
Details
- ISSN :
- 01694332
- Volume :
- 396
- Database :
- OpenAIRE
- Journal :
- Applied Surface Science
- Accession number :
- edsair.doi...........dc7e786c98a3b9c1a6da4d418ce60050
- Full Text :
- https://doi.org/10.1016/j.apsusc.2016.10.198