Design for Back-end-of-Line Processes

Completed wafers from the foundry go through the back-end-of-line (BEOL) to become individually packaged and tested die. The back end process imposes requirements on the MEMS die design and wafer layout, which are best accommodated in the early development stages. This chapter describes BEOL activities and points out some of the requirements imposed on MEMS die design and wafer layout.