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Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture
- Source :
- Advanced Materials Research. 135:393-397
- Publication Year :
- 2010
- Publisher :
- Trans Tech Publications, Ltd., 2010.
-
Abstract
- The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.
Details
- ISSN :
- 16628985
- Volume :
- 135
- Database :
- OpenAIRE
- Journal :
- Advanced Materials Research
- Accession number :
- edsair.doi...........de33e04778aa4f5cc2e7675681c7073f