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Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning
- Source :
- Materials Science in Semiconductor Processing. 145:106618
- Publication Year :
- 2022
- Publisher :
- Elsevier BV, 2022.
Details
- ISSN :
- 13698001
- Volume :
- 145
- Database :
- OpenAIRE
- Journal :
- Materials Science in Semiconductor Processing
- Accession number :
- edsair.doi...........e1258d4468f99bca37c848712d58d9f8
- Full Text :
- https://doi.org/10.1016/j.mssp.2022.106618