Creep-Fatigue Life Evaluation for Sn-3.5Ag Solder

This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter.