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Improving stamps for 10 nm level wafer scale nanoimprint lithography
- Source :
- Microelectronic Engineering. :441-448
- Publication Year :
- 2002
- Publisher :
- Elsevier BV, 2002.
-
Abstract
- The smaller the features on the stamp the more important are the interactions between stamp and polymer layer. A stamp rich in small structures will effectively show a surface area enlargement, which generally leads to adhesion of the polymer to the stamp. This makes a subsequent imprint impossible without troublesome and time-consuming cleaning. The anti-adhesion properties of Si- or SiO2-based stamps can be improved by binding fluorinated silanes covalently to the surface. In this paper, we demonstrate that the deposition procedure as well as the environment during deposition are important with respect to the quality and performance of the molecular layer. (C) 2002 Published by Elsevier Science B.V.
- Subjects :
- chemistry.chemical_classification
Materials science
Silanes
PDMS stamp
Nanotechnology
Polymer
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Nanoimprint lithography
law.invention
chemistry.chemical_compound
chemistry
law
Wafer
Electrical and Electronic Engineering
Lithography
Layer (electronics)
Embossing
Subjects
Details
- ISSN :
- 01679317
- Database :
- OpenAIRE
- Journal :
- Microelectronic Engineering
- Accession number :
- edsair.doi...........e6edbf337c3af2688fe7a770cb06d33f
- Full Text :
- https://doi.org/10.1016/s0167-9317(02)00464-1