Study on the methods of tuning thermal contact resistance of nanoparticles

Thermal contact resistance plays an important role for the appropriate application of nanoparticles, and the thermal performance of nanoparticles can be further improved by tune thermal contact resistance. In this work, cold-pressing, acetic treatment and sintering treatment are introduced to study the methods to tailor thermal contact resistance of copper nanoparticles. With the effect of preparation pressure, acetic acid treatment and sintering treatment on the thermal contact resistance studied, results show that pressing pressure can effectively tune the thermal contact resistance of nanoparticle beds by increasing heat-transfer routes and contact areas. Sintering treatment can tailor thermal contact resistance significantly by change grain size and lattice defect on the contact area. Acetic acid treatment can reduce thermal contact resistance obviously by destroying oxide layer coating on the copper surface. This work is expected to supply some information for improving the thermal conductivity of nanoparticles.