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Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations

Authors :
Richard J. F. van Haren
Suwen Li
Blandine Minghetti
Leon van Dijk
Klaas Brantjes
Frank Fournel
Gaelle Mauguen
Ivanie Mendes
Celine Lapeyre
Marie-Line Pourteau
Michael May
Laurent Pain
Karine Abadie
Thomas Plach
Markus Wimplinger
Source :
Metrology, Inspection, and Process Control XXXVII.
Publication Year :
2023
Publisher :
SPIE, 2023.

Details

Database :
OpenAIRE
Journal :
Metrology, Inspection, and Process Control XXXVII
Accession number :
edsair.doi...........e862adc42bab3ca9880716dfc29b9548

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