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2-D Photo-Thermal Distribution and Structures of Flip-Chip Mini Light-Emitting Diodes by Microscopic Hyperspectral Imaging
- Source :
- IEEE Transactions on Instrumentation and Measurement. 72:1-8
- Publication Year :
- 2023
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2023.
- Subjects :
- Electrical and Electronic Engineering
Instrumentation
Subjects
Details
- ISSN :
- 15579662 and 00189456
- Volume :
- 72
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Instrumentation and Measurement
- Accession number :
- edsair.doi...........e89f9a7df72992a35e4eb1fe56696dd5
- Full Text :
- https://doi.org/10.1109/tim.2023.3251405