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Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module
- Source :
- 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
- Publication Year :
- 2016
- Publisher :
- IEEE, 2016.
-
Abstract
- A semiconductor industry has been encountered a memory bandwidth bottleneck toward a high density and high bandwidth system. In order to overcome those limitations, a 3D stacked high bandwidth memory (HBM) based on a through silicon via (TSV) and fine pitch interposer technology is lately introduced. By adopting this structure, thousands numbers of input/output (I/O) channels with a fine pitch can be integrated on HBM interposer which enables a terabyte/s bandwidth system. On the HBM interposer, significant numbers of I/O are integrated and they tend to operate at the same time which leads to severe simultaneous switching noise (SSN). When SSN occurs, the performance of system can be heavily degraded. Total SSN is strongly related to the self-noise and transfer-noise. In this point of view, a proper PDN design to manage transfer noise which is closely related to transfer-impedance must be taken into account. The analysis of power distribution network (PDN) impedance of HBM interposer must be performed since it generally affects power supply to the chips as well as signal integrity (SI). In this paper, HBM interposer with five layers is designed to analyze PDN. For PDN impedance analysis, Z-parameters depending on the various physical dimensions are simulated and compared. PDN impedance of HBM interposer is simulated and analyzed in the interest of frequency range dominated by interposer PDN. In order to suppress SSN, we suggest a metal-insulator-metal (MIM) de-cap scheme which can be commonly available for HBM interposer to reduce PDN impedance. Based on the designed physical dimension and material properties of HBM interposer, we successfully shows the suppression of SSN.
- Subjects :
- 010302 applied physics
Engineering
Through-silicon via
business.industry
Electrical engineering
020206 networking & telecommunications
Memory bandwidth
02 engineering and technology
High Bandwidth Memory
01 natural sciences
Inductance
0103 physical sciences
0202 electrical engineering, electronic engineering, information engineering
Electronic engineering
Bandwidth (computing)
Interposer
Signal integrity
business
Electrical impedance
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
- Accession number :
- edsair.doi...........e9fddb4a718f106abbec2740f189a2aa