Cite
Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board
MLA
Haiying Wang, et al. “Investigation on Cu–Sn Intermetallic Compounds Growth and Signal Transmission Loss of the Diverse Copper Lines after Soldering in Printed Circuit Board.” Journal of Materials Science: Materials in Electronics, vol. 32, Aug. 2021, pp. 22372–86. EBSCOhost, https://doi.org/10.1007/s10854-021-06723-7.
APA
Haiying Wang, Yuanming Chen, Yuyao Luo, Jianrong Fang, Shouxu Wang, Yiling Ye, Jiaying Xu, Xiangqing You, Guoyun Zhou, Wei He, Zhengdong Tan, & Lingzhi Zhang. (2021). Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board. Journal of Materials Science: Materials in Electronics, 32, 22372–22386. https://doi.org/10.1007/s10854-021-06723-7
Chicago
Haiying Wang, Yuanming Chen, Yuyao Luo, Jianrong Fang, Shouxu Wang, Yiling Ye, Jiaying Xu, et al. 2021. “Investigation on Cu–Sn Intermetallic Compounds Growth and Signal Transmission Loss of the Diverse Copper Lines after Soldering in Printed Circuit Board.” Journal of Materials Science: Materials in Electronics 32 (August): 22372–86. doi:10.1007/s10854-021-06723-7.