Life Prediction Model Development of BGA Solder Joint Under Random Vibration

Automotive industry faces social demands of advancing the performance and efficiency, which leads to the increasing development and adoption of vehicle electronic instrument. The properties of the Ball Grid Array (BGA) packages such as smaller size and higher I/O counts make them attractive for the automotive electronics application. The application of the BGA package raises doubts for the reliability in automotive harsh environment. Vibration environment originated from the engine or outside of a vehicle is one of the detrimental stress factors for the electronic instrument [1].Copyright © 2011 by ASME