Paperless manufacturing for IC assembly

The ongoing paperless manufacturing programs in application-specific integrated circuit (ASIC) assembly operations are described. Drawbacks of paperwork and approaches to paperwork elimination are discussed. Two projects related to paperless manufacturing in ASIC assembly are presented: an automated marking system project, which minimized operator input during product marking operation, and an electronic specification system project, which facilitated point-of-use specification retrieval. Some aspects of an integrated shop floor control system that addresses process control and lot tracking issues are discussed. >