Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials

Authors :: Xiangrong Chen
Qilong Wang
Xiaofan Huang
Muhammad Awais
Ashish Paramane
Na Ren
Source :: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1109-1121
Publication Year :: 2022
Publisher :: Institute of Electrical and Electronics Engineers (IEEE), 2022.

Subjects :: Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

ISSN :: 21563985 and 21563950
Volume :: 12
Database :: OpenAIRE
Journal :: IEEE Transactions on Components, Packaging and Manufacturing Technology
Accession number :: edsair.doi...........ed083fe00a2e4253033fcf3b67f3a65e

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