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Novel method for NCF flow simulation in HBM thermal compression bonding process to optimize the NCF shape

Authors :
Jong Pa Hong
Su Chang Lee
Sun Woo Han
Sang Kun Oh
Sang Sik Park
Hyeong Mun Kang
Won Keun Kim
Kil Soo Kim
Dan Oh
Source :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Accession number :
edsair.doi...........ed51171a6014879b7d920ad93bdc51d1
Full Text :
https://doi.org/10.1109/ectc51906.2022.00088
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