Micro Embedded Metal-mesh Transparent Electrodes (Micro-EMTEs) Fabricated by TEIT Strategy

This chapter presents the LEIT fabrication for micro-EMTEs in detail. The LEIT fabrication approach replaces vacuum-based metal deposition with an electrodeposition and is potentially suitable for high-throughput, large-volume and low-cost production. This approach can be easily adapted to make flexible and even stretchable devices Jang et al. (IEEE transaction on Antenna and Propagation, 2015 [1]). Prototype copper micro-EMTEs are fabricated on flexible COC films with superior electrical conductivity and optical transmittance. FoM (σdc/σopt) values as high as 1.5 × 104 have been demonstrated on the sample copper micro-EMTEs. This fabrication process has been demonstrated to be able to scale for a larger EMTE area and a wide range of materials. Because of the electrode’s embedded nature, excellent mechanical, chemical, and environmental stability were observed