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Effect of Additives on Direct Copper Electrodeposition on Transition Metal Diffusion Barriers for Silicon-based Integrated Devices
- Source :
- ECS Meeting Abstracts. :2736-2736
- Publication Year :
- 2012
- Publisher :
- The Electrochemical Society, 2012.
-
Abstract
- not Available.
Details
- ISSN :
- 21512043
- Database :
- OpenAIRE
- Journal :
- ECS Meeting Abstracts
- Accession number :
- edsair.doi...........edb4194aad32e2fdb1132d9f0b3bdd45
- Full Text :
- https://doi.org/10.1149/ma2012-02/34/2736