High lead solder failure and microstructure analysis in die attach power discrete packages

MLA

Kenny Chiong, et al. “High Lead Solder Failure and Microstructure Analysis in Die Attach Power Discrete Packages.” 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Nov. 2016. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........eecf5746b94a80ef4f3ebef0d8295216&authtype=sso&custid=ns315887.

APA

Kenny Chiong, HongWen Zhang, & Sze Pei Lim. (2016). High lead solder failure and microstructure analysis in die attach power discrete packages. 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Chicago

Kenny Chiong, HongWen Zhang, and Sze Pei Lim. 2016. “High Lead Solder Failure and Microstructure Analysis in Die Attach Power Discrete Packages.” 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), November. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........eecf5746b94a80ef4f3ebef0d8295216&authtype=sso&custid=ns315887.