Back to Search Start Over

Examination of residual stress measurement in electronic packages using phase-shifted sampling moiré method and X-ray images

Authors :
Akihiro Ikeda
Masakazu Uchino
Tanemasa Asano
Masaaki Koganemaru
Source :
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Publication Year :
2014
Publisher :
IEEE, 2014.

Subjects

Subjects :
Electronic packages
Optics
Materials science
Residual stress
business.industry
Phase shifted
X ray image
Analytical chemistry
Sampling (statistics)
Moiré pattern
business

Details

Database :
OpenAIRE
Journal :
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)
Accession number :
edsair.doi...........f58aaeb48d97455e443e6325ae5dd892
Full Text :
https://doi.org/10.1109/estc.2014.6962827
Full Text Access
View/download PDF

Tools

Authors Abstract Subjects Details