Study of Large Exposure Field Lithography for Advanced Chiplet Packaging

Authors :: Hiromi Suda
Douglas Shelton
Hiroki Takada
Yoshio Goto
Kosuke Urushihara
Ken-Ichiro Shinoda
Source :: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publication Year :: 2022
Publisher :: IEEE, 2022.

Database :: OpenAIRE
Journal :: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Accession number :: edsair.doi...........f845e89fe3f14dc5d224e452712eee2f
Full Text :: https://doi.org/10.1109/ectc51906.2022.00317