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Lithographic evaluation of a new wet silylation process using safe solvents and the commercial photoresist AZ 5214ETM
- Source :
- Scopus-Elsevier
- Publication Year :
- 1994
- Publisher :
- Elsevier BV, 1994.
-
Abstract
- A positive-tone wet silylation process for I-line lithography is developed, using safe solvents and the commercial photoresist AZ 5214E (by Hoechst). The process is capable of resolving 0.3 μm lines and spaces on photoresist. Various silylating conditions, solution concentrations and two silylating agents namely HMCTS and B(DMA)DS have been tried. Silicon concentration, focus and exposure latitudes have been defined.
- Subjects :
- Materials science
Silylation
Silicon
chemistry.chemical_element
Photoresist
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Chemical engineering
chemistry
Scientific method
Organic chemistry
Electrical and Electronic Engineering
Lithography
Subjects
Details
- ISSN :
- 01679317
- Volume :
- 23
- Database :
- OpenAIRE
- Journal :
- Microelectronic Engineering
- Accession number :
- edsair.doi.dedup.....0709c0ec369c89fec4a6d6ca1fe0cb13
- Full Text :
- https://doi.org/10.1016/0167-9317(94)90152-x