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Convective Heat Transfer Enhancement for Electronic Device Applications using Patterned MWCNTs Structures

Authors :
Matteo Cocuzza
Luigi Ventola
Eliodoro Chiavazzo
Mauro Giorcelli
Pietro Asinari
Denis Perrone
Nadia Shahzad
Muhammad Imran Shahzad
Alberto Tagliaferro
Source :
Heat transfer engineering (Online) 37 (2016): 783–790. doi:10.1080/01457632.2015.1080570, info:cnr-pdr/source/autori:M. I. Shahzad and M. Giorcelli and L. Ventola and D. Perrone and N. Shahzad and E. Chiavazzo and P. Asinari and M. Cocuzza and A. Tagliaferro/titolo:Convective Heat Transfer Enhancement for Electronic Device Applications using Patterned MWCNTs Structures/doi:10.1080%2F01457632.2015.1080570/rivista:Heat transfer engineering (Online)/anno:2016/pagina_da:783/pagina_a:790/intervallo_pagine:783–790/volume:37
Publication Year :
2016
Publisher :
Taylor & Francis, 2016.

Abstract

This article reports on the heat transfer characteristics of columnar, vertically aligned, multiwall carbon nanotubes grown on a patterned Si surface. In the first part, we describe the procedure for patterning the silicon (Si) surface and the growth of multiwall carbon nanotubes (MWCNTs) on these patterned surfaces. The diameter of MWCNTs grown by chemical vapor deposition technique was in the range of 30–80 nm. In the second part, structures mimicking macroscopic finned heat sinks are used for enhancing forced convective heat transfer on a silicon substrate. Convective heat transfer coefficient has been experimentally measured for silicon substrates with and without MWCNT-based fins on it. The configuration with MWCNTs based fins shows an enhancement in convective heat transfer of 40% and 20%, as maximum and average value, respectively, compared to the bare silicon. Experiments have been carried out in a wind tunnel with air as coolant in fully turbulent regime. These encouraging results and the possibi...

Details

Language :
English
Database :
OpenAIRE
Journal :
Heat transfer engineering (Online) 37 (2016): 783–790. doi:10.1080/01457632.2015.1080570, info:cnr-pdr/source/autori:M. I. Shahzad and M. Giorcelli and L. Ventola and D. Perrone and N. Shahzad and E. Chiavazzo and P. Asinari and M. Cocuzza and A. Tagliaferro/titolo:Convective Heat Transfer Enhancement for Electronic Device Applications using Patterned MWCNTs Structures/doi:10.1080%2F01457632.2015.1080570/rivista:Heat transfer engineering (Online)/anno:2016/pagina_da:783/pagina_a:790/intervallo_pagine:783–790/volume:37
Accession number :
edsair.doi.dedup.....0e4c348dea3d762b73734d4b50095216
Full Text :
https://doi.org/10.1080/01457632.2015.1080570