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Optical Transimpedance Receiver for High Data Transmission in OFDM Modulation Format

Authors :
Frederique Deshours
Georges Alquie
Ghalid Idir Abib
Emmanuel Grard
Victor Rodrigues
Eric Leclerc
Ali Kabalan
Anne-Laure Billabert
Laboratoire d'Electronique et Electromagnétisme (L2E)
Université Pierre et Marie Curie - Paris 6 (UPMC)
Département Electronique et Physique (TSP - EPH)
Institut Mines-Télécom [Paris] (IMT)-Télécom SudParis (TSP)
3S Photonics
United Monolithic Semiconductors (UMS)
Electronique, Systèmes de communication et Microsystèmes (ESYCOM)
Conservatoire National des Arts et Métiers [CNAM] (CNAM)
HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris
Département Electronique et Physique (EPH)
Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris-Conservatoire National des Arts et Métiers [CNAM] (CNAM)
Source :
Journal of Lightwave Technology, Journal of Lightwave Technology, 2015, 33 (10), pp.2004-2011. ⟨10.1109/JLT.2015.2399976⟩, Journal of Lightwave Technology, Institute of Electrical and Electronics Engineers (IEEE)/Optical Society of America(OSA), 2015, 33 (10), pp.2004-2011. ⟨10.1109/JLT.2015.2399976⟩
Publication Year :
2015
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2015.

Abstract

International audience; This paper presents the design and performance of a single-ended transimpedance amplifier (TIA) for gigabit passive optical networks (GPON) implementing orthogonal frequency division multiplexing (OFDM) modulation format. The circuit is realized using an industrial GaAs integrated technology. Low power consumption and small chip area are the main challenges in the TIA design. On-wafer characterization in terms of S-parameters, noise figure, gain compression and intermodulation are presented and compared to simulated results showing a good agreement. The TIA is linked with a broadband PIN photodiode and introduced in a radio over fiber (RoF) system. The optical link is simulated in a microwave software and characterized in terms of error vector magnitude (EVM) by varying the radio frequency (RF) input power and the laser bias current.

Details

ISSN :
15582213 and 07338724
Volume :
33
Database :
OpenAIRE
Journal :
Journal of Lightwave Technology
Accession number :
edsair.doi.dedup.....1700962ade855d06eaaea7a84529d309