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Two-photon-assisted polymerization and reduction : emerging formulations and applications

Authors :
Gia Chuong Phan-Quang
Xing Yi Ling
Howard Yi Fan Sim
Charlynn Sher Lin Koh
Yih Hong Lee
In Yee Phang
Chee Leng Lay
Xuemei Han
Shi Xuan Leong
School of Physical and Mathematical Sciences
Institute of Materials Research and Engineering, A*STAR
Publication Year :
2020

Abstract

Two-photon lithography (TPL) is an emerging approach to fabricate complex multifunctional micro/nanostructures. This is because TPL can easily develop various 2D and 3D structures on a variety of surfaces, and there has been a rapidly expanding pool of processable photoresists to create different materials. However, challenges in developing two-photon processable photoresists currently impede progress in TPL. In this review, we critically discuss the importance of photoresist formulation in TPL. We begin by evaluating the commercial photoresists to design micro/nanostructures for promising applications in anti-counterfeiting, superomniphobicity, and micromachines with movable parts. Next, we discuss emerging hydrogel/organogel photoresists, focusing on customizing photoresist formulations to fabricate reconfigurable structures that can respond to changes in local pH, solvent, and temperature. We also review the development of metal salt-based photoresists for direct metal writing, whereby various formulations have been developed to enable applications in online sensing, catalysis, and electronics. Finally, we provide a critical outlook and highlight various outstanding challenges in formulating processable photoresists for TPL. Ministry of Education (MOE) Nanyang Technological University Accepted version X.Y.L. thanks Singapore Ministry of Education, Tier 1 (RG11/18) and Tier 2 (MOE2016-T2-1-043) grants, and Max PlanckInstitute−Nanyang Technological University Joint Lab for the financial support. C S.L.K., G.C.P.-Q., and S.X.L. thank the Nanyang President’s Graduate Scholarships.

Details

Language :
English
Database :
OpenAIRE
Accession number :
edsair.doi.dedup.....1a5a64040bf584d0f849dfd92f9625b2