Fast and Accurate Modelling of Large TSV Arrays in 3D-ICs Using a 3D Circuit Model Validated Against Full-Wave FEM Simulations and RF Measurements

This paper presents a 3D circuit model capable of rapidly and accurately evaluating substrate noise coupling in the context of 3D integration. Since TSVs are large and noisy structures, the evaluation of electromagnetic coupling to and from TSVs has become crucial to the design of three-dimensional integrated circuits. In this work, we present a fast and accurate 3D circuit model to this end. The model is verified against full-wave simulations and wideband Sparameter measurements of three different TSV structures, including guard rings and up to four TSVs. The model maintains the accuracy of full-wave simulations while presenting a speed increase of 2 to 3 orders of magnitude. This features enables the model to investigate the coupling parameters and crosstalk voltages in very large and complex 3D volumes. Our powerful model provides new opportunities in large scale analysis, and as an example an 11x11 TSV array is simulated in both frequency-and time-domain over a wide frequency band including 121 TSVs and circuit nodes.