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Effect of phenolic acids on temperature-sensitive property of self-assembly of ionic pair of poly(ethylene imine)/(phenylthio)acetic acid

Authors :
Jin-Chul Kim
Fanyu Zhao
Source :
Journal of Industrial and Engineering Chemistry. 122:529-539
Publication Year :
2023
Publisher :
Elsevier BV, 2023.

Abstract

The ionic pair self-assembly (IPSAM) composed of poly(ethyleneimine) (PEI) and (phenylthio)acetic acid (PTA) was prepared and the effect of phenolic acids (PAs) (e.g. cinnamic acid (CA), hydroxycinnamic acid (HCA), and dihydroxycinnamic acid (DHCA)) on the upper critical solution temperature (UCST) and the temperature-responsive releasing property of IPSAM were investigated. PEI/PTA ionic pair showed a UCST behavior and the PAs decreased the UCST effective in the order of DHCA > HCA > CA. The PAs were thought to attach to the PEI chain of PEI/PTA ionic pair as pendants. According to the interfacial tensiometry, PEI/PTA(3/7) ionic pair was found to be air/water interface-active due to their amphiphilic property. CA had little effect on the interfacial activity of the ionic pair. HCA and HDCA significantly decreased the interfacial activity possibly because they are more polar than CA thus the hydrophilic and lipophilic balance of PEI/PTA ionic pair could be broken by their attachment to PEI chains. IPSAM was found as nanoparticles whose diameter was tens of nanometer and PAs had little effect on the shape and the size of IPSAM, once the UCST of PEI/PTA/PA ionic pair was above room temperature where the TEM micrographs were taken. If the UCST of PEI/PTA/PA ionic pair was below room temperature, no particulate matters were found on the TEM micrographs. The release degree of cargo loaded in IPSAM increased slowly with time lapse below UCST. Whereas, the release degree increased rapidly with time lapse above UCST, possibly because of the thermally-induced disintegration of IPSAM.

Details

ISSN :
1226086X
Volume :
122
Database :
OpenAIRE
Journal :
Journal of Industrial and Engineering Chemistry
Accession number :
edsair.doi.dedup.....331550f74f665f6f660406c8dd27fdb2