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A general approach to composites containing nonmetallic fillers and liquid gallium
- Source :
- Science Advances
- Publication Year :
- 2021
- Publisher :
- American Association for the Advancement of Science (AAAS), 2021.
-
Abstract
- Presenting a versatile method to make soft, deformable, functional metallic “putty” from liquid gallium and nonmetallic fillers.<br />We report a versatile method to make liquid metal composites by vigorously mixing gallium (Ga) with non-metallic particles of graphene oxide (G-O), graphite, diamond, and silicon carbide that display either paste or putty-like behavior depending on the volume fraction. Unlike Ga, the putty-like mixtures can be kneaded and rolled on any surface without leaving residue. By changing temperature, these materials can be stiffened, softened, and, for the G-O–containing composite, even made porous. The gallium putty (GalP) containing reduced G-O (rG-O) has excellent electromagnetic interference shielding effectiveness. GalP with diamond filler has excellent thermal conductivity and heat transfer superior to a commercial liquid metal–based thermal paste. Composites can also be formed from eutectic alloys of Ga including Ga-In (EGaIn), Ga-Sn (EGaSn), and Ga-In-Sn (EGaInSn or Galinstan). The versatility of our approach allows a variety of fillers to be incorporated in liquid metals, potentially allowing filler-specific “fit for purpose” materials.
- Subjects :
- Liquid metal
Materials science
Materials Science
chemistry.chemical_element
02 engineering and technology
engineering.material
010402 general chemistry
01 natural sciences
law.invention
chemistry.chemical_compound
law
Silicon carbide
Graphite
Composite material
Gallium
Research Articles
Eutectic system
Multidisciplinary
Graphene
SciAdv r-articles
Diamond
021001 nanoscience & nanotechnology
0104 chemical sciences
Galinstan
chemistry
engineering
0210 nano-technology
Research Article
Subjects
Details
- ISSN :
- 23752548
- Volume :
- 7
- Database :
- OpenAIRE
- Journal :
- Science Advances
- Accession number :
- edsair.doi.dedup.....347457057c0c0448f1e28c20b6404133
- Full Text :
- https://doi.org/10.1126/sciadv.abe3767