A Virtual Metrology System for Predicting CVD Thickness with Equipment Variables and Qualitative Clustering

In semiconductor manufacturing plants, monitoring of all wafers is fundamental in order to maintain good yield and high quality standards. However, this is a costly approach and in practice only few wafers in a lot are actually monitored. With a Virtual Metrology (VM) system it is possible to partly overcome the lack of physical metrology. In a VM scheme, tool data are used to predict, for every wafer, metrology measurements. In this paper, we present a VM system for a Chemical Vapor Deposition (CVD) process. Various data mining techniques are proposed. Due to the huge fragmentation of data derived from CVD's mixed production, several kind of data clustering have been adopted. The proposed models have been tested on real productive industrial data sets.