A 0.13 μm CMOS technology with 193 nm lithography and Cu/low-k for high performance applications

A leading-edge 0.13 /spl mu/m CMOS technology using 193 nm lithography and Cu/low-k interconnect is described in this paper. High performance 80 nm core devices use 17 /spl Aring/ nitrided oxide for 1.0-1.2 V operation. These devices deliver unloaded 8.5 ps gate delay @1.2 V. This technology also supports general ASIC applications with 20 /spl Aring/ oxide for 1.2-1.5 V operation and low-standby power applications with 26 /spl Aring/ for 1.5 V operation, respectively. Dual gate oxides of 50 or 65 /spl Aring/ are also supported for 2.5 V or 3.3 V I/O circuits respectively. Cu with low-k dielectric is used for the 8-layer metal interconnect system with tight pitch. The aggressive design rules and border-less contacts/vias support a high density 1P3M 2.43 /spl mu/m/sup 2/ 6T-SRAM cell without local interconnect. A suite of embedded SRAM cells (6T, 8T) with competitive density and performance optimized for different applications are also supported with memory compilers and large block macros.